Gandhinagar: Prime Minister Narendra Modi will inaugurate Micron Technology’s state-of-the-art ATMP (Assembly, Testing, Marking and Packaging) plant in Sanand, Gujarat, on February 28, 2026. Micron Semiconductor Technology India Pvt. Ltd. has invested ₹22,516 crore in the Sanand facility. The launch of this ATMP plant marks the beginning of a new chapter in India’s semiconductor journey.

2,000 Personnel Currently at Work; Employment Opportunities for Divyang Citizens

Micron’s Sanand plant is on track to become operational as scheduled. The ATMP (Assembly, Testing, Marking and Packaging) facility will manufacture solid-state drives (SSDs) as well as DRAM and NAND memory products.

At present, around 2,000 people are working at the facility. In the long term, the project is expected to generate approximately 5,000 direct jobs. According to the Micron team, Divyang (specially-abled) citizens are serving as operators and technicians, and the plant offers opportunities to skilled individuals from diverse sections of society.

Sanand-Made Products Crucial for AI Technology

Sanjay Mehrotra, Chairman, President and CEO of Micron Technology, stated that memory and storage are central to modern technology, particularly in the field of artificial intelligence (AI). He noted that AI systems rely heavily on robust memory and storage infrastructure to function efficiently. As AI applications continue to deliver faster, real-time responses, demand for advanced memory solutions is steadily rising.

How Does an ATMP Plant Work?

The functioning of an ATMP plant begins with wafer chips. To understand this, it is important to first examine how semiconductor chips are manufactured before reaching the ATMP stage.

The process starts with sand, from which pure silicon is extracted. The silicon is melted and shaped into a cylindrical structure known as an ingot. The ingot is then sliced into thin discs called wafers. At a fabrication plant (fab), electronic circuit patterns are printed onto these wafers, and multiple layers are added.

Through a process known as photolithography, these layers are precisely structured to form transistors on the wafers. This is how memory circuits are created within the silicon wafer. Finally, the wafers are cut into small square pieces known as chips (or dies).

These chips are then sent to the ATMP plant. Here, they are assembled into packages. In the next stage, they undergo rigorous testing to evaluate speed, memory capacity, and overall performance. After testing, the chips are marked with necessary specifications and then packaged for market distribution.

The Sanand plant will manufacture integrated circuit (IC) packages, modules, and solid-state drives for the global market. It will receive advanced DRAM and NAND wafers from Micron’s global fabrication facilities and convert them into finished memory products. These products will support the growing demand for memory and storage solutions, particularly in AI-driven applications. DeshGujarat