NIELIT-Infineon Semiconductor Packaging CoE inaugurated in Ahmedabad

Ahmedabad: The NIELIT–Infineon Semiconductor Packaging Centre of Excellence (CoE) was inaugurated at ITI Chandkheda in Ahmedabad during SEMICON India 2026, held in Delhi, marking a step towards strengthening semiconductor manufacturing skills and training in the city.

Union Minister of State for Electronics and Information Technology Jitin Prasada inaugurated the centre, which is equipped with eight industry-grade machines provided by global semiconductor company Infineon Technologies.

The centre will offer hands-on training in semiconductor backend manufacturing processes, including die bonding, wire bonding, moulding, trimming and lead forming.

It will provide practical exposure to students, technicians, engineers, faculty members and industry professionals, with training aligned with global semiconductor manufacturing practices.

Located within ITI Chandkheda, the facility is also expected to strengthen Ahmedabad’s role in semiconductor skills development and technology training.

“The partnership combines NIELIT’s extensive educational network with Infineon’s global expertise in semiconductor manufacturing, assembly, testing and packaging, enabling practical learning at scale and contributing to the development of a future-ready semiconductor talent base,” said Jochen Hanebeck, CEO, Infineon Technologies. DeshGujarat